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By Alwyn T. Lloyd

D&S Vol. eleven

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Extra resources for B-17 Flying Fortress in Detail and Scale, Part 2 Derivatives Vol 11

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The analysis can be extended to nonmechanical loads, for example, temperature. Additionally, finite element simulation techniques have been 39 40 MEMS Simulation and Design Tools successfully applied to simulate electromagnetic fields, thermodynamic problems such as squeeze film damping, and fluidics. FEM results in more realistic simulation results than behavioral modeling, but it is much more computationally demanding and hence it is difficult to simulate entire systems. 1 Behavioral Modeling Simulation Tools Matlab and Simulink One of the most popular behavioral modeling tools is Simulink, which is a toolbox within Matlab [1].

After exposure with the pattern, the resist is developed. The PMGI SF11 develops at a faster rate than the standard resist, thereby leaving an overhang. Other materials can be used in a liftoff process. For example, the two layers of resist can be replaced by aluminum and polysilicon with orthophosphoric acid used both to create the overhang and to do the final liftoff. Providing that the layer to be patterned is not chemically attacked by orthophosphoric acid, the process will work. 5 Topography Deep cavities etched into silicon are a common feature in MEMS devices, and ideally, the processing steps to produce these are done at the end of the process.

SF6 is typically used because of the high etch rates that can be achieved. The passivation can be enhanced by the addition of oxygen to the plasma, which results in oxidation of the sidewalls. Possible problems with the cryogenic approach are in maintaining the temperature of structures during the etch process. Some structures may become thermally isolated resulting in adverse thermal stress. The other process is one patented by Bosch which uses alternate etch and passivation steps [19]. The passivation is achieved by deposition of a polymer using C4F8 as a source gas.

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